- single-sided, double-sided a multilayer including HDI
- min. connection distance 0,1 mm
- min. insulation distance 0,1 mm
- blind and buried holes
- blind and buried holes
- HAL leaded and unleaded, chemical tin, chemical Ni/Au, galvanic Ni/Au
- screen printing – service printing, conductive printing, removable layers
- drilled, etched and laser cut stencils
- metallographic samples
- milling, grooving, cutting
- AOI and electrical testing
Category SAMPLE
- advantageous is the reduction of one-off costs
- max. area 6 dm2 per board, max. area 18 dm2 total per order
- if the order is repeated, only difference of one-off costs is charged
Terms:
- STANDARD 8 work days
- category SAMPLE 5 work days
- EXPRESS – 8 hours (depends on DPS complexity)
Table of categories for PCB production and criteria
Category | Criteria | ||||||
POOL service | material: FR4 (Double sided PCB), IS400 (Multilayer PCB), 35μm end Cu, 2x green soldermask, 1x white silkscreen | ||||||
surface: HAL Pb free, Ni/Au | |||||||
charged surface from 1 dm² | |||||||
term (working days): | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
surcharge for Double sided PCB | + 150 % | + 90 % | + 80 % | + 70 % | - | - | - |
surcharge for Multilayer PCB | + 150 % | + 90 % | + 80 % | + 70 % | - | - | - |
SAMPLE (prototype) | it is valid for all types of PCB with an order area up to 20 dm² | ||||||
standard term is 5 working days | |||||||
term (working days): | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
express surcharge: | + 200 % | + 100 % | + 80 % | + 30 % | - | - | - |
SERIES | it is valid for all types of PCB with an order area over 20 dm² | ||||||
standard term from 8 working days | |||||||
Cost optimization through import from reliable suppliers from China | |||||||
term (working days): | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
express surcharge: | + 300 % | + 150 % | + 100 % | + 80 % | + 60 % | + 40 % | + 25 % |
For the professional production of printed circuit boards, we cooperate with a number of manufacturers in Czech Republic and we also have proven quality suppliers from China.
Technical possibilities of PCB production
Parameter | Standard | Special |
PCB | Single and Double sided, Multilayer PCB (up to 20 layers), IMS Al, IMS Cu | FLEX-RIGID, flex, semiflex |
Data input | Gerber RS-274X, ODB++ | Eagle |
Material | FR4, IS400, PCL370HR, RO4350B, RO3003 | CEM1, P96, Polyimid, Al, Cu/td> |
Maximal dimension of PCB | 450 x 480 mm – Single and Double sided PCB | |
430 x 480 mm – Multilayer PCB | ||
Cu thickness | 5, 9, 18, 35, 70, 105, 140 µm | 210 µm |
Thickness of RIGID material | 0,5 – 3,2 mm | |
Thickness of FLEX material | 25, 50, 75, 100 a 125 µm | |
Minimal thickness of PCB | Double sided – 0,1 mm | |
4layers – 0,3 mm | ||
6layers – 0,5 mm | ||
8layers – 0,7 mm | ||
min. width path / space | 100 / 100 µm | 70 / 70 µm |
Aspect Ratio | 10:1, blind VIA 1:1 | by agreement 20:1 |
The smallest drilled hole | 0,15 mm | by agreement 0,1 mm |
The smallest mill diameter | 1,0 mm | 0,6 mm |
Surfaces | ENIG (Ni/Au) | |
Lead-free HAL | ||
Lead HAL | ||
Chemical Tin (Sn) | ||
Universal Pad Finish – ENEPIG (Ni/Pd/Au) | ||
Galvanic Au | ||
Soldermask | green, red, white, black, blue | |
Silkscreen | white, black, yellow | |
Testing | AOI and flying probe electrical test | |
Cutting PCB | milling, V-CUT | |
Special technology | blind and burried VIA | |
HDI (High Density Interconnects) | ||
SBU (Sequential Build-Up) | ||
Filled and Capped VIA | ||
Press-fit | ||
peelable mask | ||
Carbon paste | ||
Dodací lhůty neosazených DPS | Standard - 5 pracovních dnů | Expres - od jednoho pracovního dne |
Quantity of PCB | 1 pc – 1.000+ pcs | 10.000+ |
Other services | stencils (drilled, etched and laser cut) | |
metallographic cuts |