We collaborate with trusted suppliers to provide PCB manufacturing solutions. Custom-tailored options include advanced technologies, materials, and surface finishes.
Technology:
- single-sided, double-sided a multilayer including HDI, Rigid-flex, Flex, Semiflex
- min. connection distance according to manufacturer (0.05 - 0.075 mm)
- min. insulation distance according to manufacturer (0.05 - 0.075 mm)
- blind and buried holes
- solder mask – various colors
- HAL leaded and unleaded, chemical tin, chemical Ni/Au, galvanic Ni/Au, specific to the request
- screen printing – service printing, conductive printing, removable layers
- drilled, etched and laser cut stencils
- impedance controlled, gold-plated connectors
- metallographic samples, Press-fit measurement, edge plating
- milling, grooving, cutting
- AOI and electrical testing
Table of categories for PCB production and criteria
| Category | Criteria | ||||||
| POOL SERVICE | material: double-sided - FR4; Tg 135 °C; 1.5 mm 18/18 µm Cu; multilayer - FR4 IS400; Tg 150 °C; (4 L: 18/35/35/18 µm Cu; 6 L: 18/35/35/35/35/18 µm Cu), 2x green solder mask, 1x white print, E-test, tracks/insulation ≥ 150 µm, milled to PCB dimensions | ||||||
| surface finish: HAL PB Free and Immersion Gold | |||||||
| billed area starts from 1 dm² | |||||||
| lead time (working days): | 2 | 3 | 4 | 5 | 6 | 7 | |
| surcharge | + 100 % | + 80 % | + 40 % | - | - | - | |
| SAMPLE (prototype) | applies to all types of PCBs with an order area up to 50 dm² | ||||||
| standard lead time is 5 working days | |||||||
| lead time (working days): | 2 | 3 | 4 | 5 | 6 | 7 | |
| express surcharge: | + 100 % | + 80 % | + 40 % | - | - | - | |
| SERIES | applies to all types of PCBs with an order area from 50 dm² to 150 dm² | ||||||
| standard lead times from 8 working days | |||||||
| cost optimization by sourcing from verified suppliers in Asia | |||||||
| lead time (working days): | 2 | 3 | 4 | 5 | 6 | 7 | |
| express surcharge: | + 200 % | + 100 % | + 80 % | + 60 % | + 40 % | + 20 % | |
For professional PCB manufacturing, we collaborate with a wide range of manufacturers in the Czech Republic, Europe, and have verified quality suppliers from Asia.
Express PCB manufacturing with advanced technologies (impedance, filled holes, IPC3, Flex) is available on request.
Technical possibilities of PCB production
The following overview is indicative. PCB manufacturing must be inquired about before ordering to verify production feasibility.
| Parameter | Standard | Special |
| PCB | 1-layer, 2-layer, multilayer (up to 8 layers), IMS Al, IMS Cu | multilayer (9–20 layers), FLEX-RIGID, flex, semiflex |
| Input data | Gerber RS-274X, ODB++ | dxf |
| Material | FR4 – Tg135°C (Isola De104/86-UV-Block), Tg150°C (IsolaIS 400), Tg180°C (Isola 370HR); IMS – Thermalclad (1.3 W/mK, die100um), Ventec 4B3 (3.0 W/mK, die 50μm), Ventec 4B5 (4.2W/mK, die 50μm); HF – RO4350B, RO4003, RO3003, I-tera MT-40; others – 92ML | RO3035, RO5880, Rogers, Duroid, Teflon, etc. |
| Max. PCB dimensions | Maximum PCB/panel size 265 × 465 mm, Maximum technological size, IMS (metal) core 265 × 430 mm, Flexible board 265 × 428 mm, Rigid-flex 265 × 378 mm, Connector gold 265 × 363 mm, High-frequency/hybrid boards 265 × 325 mm | |
| Cu thickness | 5, 9, 18, 35, 70, 105 µm | 140, 210 µm |
| Rigid material thickness | 0.5 – 4.6 mm | 4.7 – 6 mm |
| Flex material thickness | 25, 50, 75, 100, and 125 µm | |
| Min. PCB thickness | 2-layer – 0.1 mm | |
| 4-layer – 0.3 mm | ||
| 6-layer – 0.5 mm | ||
| 8-layer – 0.7 mm | ||
| Min. track width / gap | 100 / 100 µm | 50 / 30 µm |
| Aspect Ratio | 10:1, blind VIA 1:1 | up to 20:1 by agreement |
| Smallest plated hole | 0.1 mm | up to 0.05 mm by agreement |
| Smallest milling tool | - | 0.6 mm |
| Surface finishes | Immersion gold – ENIG (Ni/Au) | |
| Lead-free HAL | ||
| Lead-based HAL | ||
| Immersion tin (Sn) | ||
| Universal Pad Finish – ENEPIG (Ni/Pd/Au) | ||
| Galvanic gold | ||
| Solder mask | green, red, white, black, blue | others upon agreement |
| Silkscreen | white, black, yellow | others upon agreement |
| Testing | AOI and flying probe electrical test | |
| Outline processing | milling, V-CUT groove, milling with drilled bridges | |
| Special technologies | blind and buried vias | Edge Plating, BGA (min. pitch 0.4 mm) |
| HDI (High Density Interconnects) | PCBs with controlled impedance; blind/buried microvias | |
| SBU (Sequential Build-Up) | ||
| Measurement of press-fit, IPC class 3, microsection, sequential lamination | filled vias | |
| Press-fit | QR codes | |
| blind holes filled with copper | removable coating | |
| carbon paste | ||
| Other services | drilled, etched, and laser-cut stencils | |
| metallographic microsections |
Our partners include:
